Paliney® H3C vs Paliney® 7

Paliney®7 is used for cantilevers, buckling beam and other semiconductor test probes where its high nobility outweighs its lower electrical conductivity. H3C is a new alloy designed to replace Paliney®7 in applications where higher hardness and higher electrical conductivity is required. Alloy H3C, the hardest of the Paliney family of alloys produced to date by Deringer-Ney is designed to be drawn down to wire diameters as fine as 0.001”. However its extreme hardness in the full hard HT temper limits its formability. In applications where formability similar to Paliney 7 along with a higher electrical conductivity is required the alloy is available in the HTB Temper which allows secondary processing operations similar to Paliney 7 including forming, coining and pointing. Other Tempers and sizes are available, please consult factory.

View Properties Table

Mechanical and Electrical Properties: Wire, 0.0015” – 0.020”
Cut Lengths - 36" maximum length

  H3C Paliney® 7
  HT Temper HTB Temper HT Temper
Ultimate Tensile Strength
(ksi)
220 - 280 190 min 160-200
Elongation
(% in 2”)
3 Max. 1.5 min 1-10
Hardness
(Knoop)
425 - 515 390 min 350-410
Electrical Conductivity
(%IACS, Nominal)

Electrical Resistivity
(microhm-cm, Nominal)
14


12.3
15


11.5
5.5


31.6

.

The information contained in this Data Sheet is intended to assist you in the use of this product. It is not intended to and does not create any warranties, express or implied, including any warranty of merchantability or fitness for a particular application. The user should determine the suitability of this material for each application. Data is subject to change without notice. Paliney® H3C is protected by U.S. patent no. 5,833,774 and Japanese patent no. 4,226,661. It is also a registered trademark of Deringer-Ney Inc.