Properties of Paliney® H3C

Paliney® H3C, which stands for High-Hardness / High Conductivity, is a patented Palladium, Copper and Silver based alloy designed for applications such as semiconductor test probes where extreme hardness and higher levels of electrical conductivity are required.  Paliney H3C is the hardest of the Paliney family of alloys produced to-date by Deringer-Ney. This alloy is designed to be drawn down to wire diameters as fine as 0.001" and to allow secondary processing operations including forming, coining and pointing.

View Properties Table

Physical Properties of Alloy H3C, Nominal

Solidus (°C)

956

Poisson’s Ratio

0.35

Liquidus (°C)

1049

Modulus of Elasticity (x106 psi)

17.5

Density (dwt / in3)

109.6

Temp. Coefficient of Resistance (10-4 / °C)

4.8

Density (gram / cc)

10.4

Thermal Coefficient of Resistance (/0 10-6)

16.1

 

Mechanical and Electrical Properties: Wire, 0.0015" – 0.020"

Properties of H3C Batch Age Hardened, Maximum 36" lengths
HT Temper HTB Temper* F9 Temper

Ultimate Tensile Strength   (ksi)

220 - 280

190 min.

210 - 260

Elongation  (% in 2")

3 max.

1.5 min

2 min

Hardness   (Knoop)

425 - 515

390 min

410 - 470

Electrical Conductivity, %IACS nominal

14

15

13 min

Electrical Resistivity, microhn - cm, Nominal

12.3

11.5

13.3

* Wire in the HTB temper can be coined and bent.

Properties of H3C Continously Hardened, Spool1 or Cut lengths
Annealed
Spool or Cut
lengths
DHT Temper CHT Temper2

Ultimate Tensile Strength   (ksi)

120 - 200

200-260.

220 - 280

Elongation  (% in 2")

5 min

3 max

3 max

Hardness   (Knoop)

270 - 340

400 - 470

425 - 515

Electrical Conductivity, %IACS nominal

8.5

11.7

14

Electrical Resistivity, microhn - cm, Nominal

20.3

14.7

12.3

1. 1500 - 4,000 foot, depending on spool diameter.
2. In the CHT temper, wire will have a maximum allowable cast of 4mm / 100 mm length.

For applications where long lengths of fine diameter Paliney H3C wire are required in peak hardened condition, a special CHT temper is available. In this temper the wire develops the following mechanical properties:

The information contained in this Data Sheet is intended to assist you in the use of this product. It is not intended to and does not create any warranties, express or implied, including any warranty of merchantability or fitness for a particular application. The user should determine the suitability of this material for each application. Data is subject to change without notice. Paliney® H3C is protected by U.S. patent no. 5,833,774 and Japanese patent no. 4,226,661. It is also a registered trademark of Deringer-Ney Inc.

For More Information

Contact Us to discuss your application with one of our Materials Specialists.