Paliney H3C

General Alloy Overview

ASTM

–

Application Examples

Semiconductor Test Probes, Cobra Probes, Cantelever Probes, Pogo Pin Tips

Industry Examples

Semiconductor

Tempers

Annealed, Cold Worked, HT Temper, HTA Temper, HTB Temper, HTC Temper, HTD and F9 HTD Temper

Available Forms

Strip, Wire, Foil

Constant (Temper - Independent) Properties

Parameter	Value
Solidus, °F (°C)	1753 (956)
Liquidus, °F (°C)	1920 (1049)
Melting Range, °F (°C)	167 (93)
Density gram / cm³ (dwt / in³)	10.39 (109.6)
Temperature Coefficent of Resistance, /°F (/K)	1.2E-03 (2.1E-03)
Coefficient of Thermal Expansion, /°F (/K)	8.3E-06 (1.5E-05)
Thermal EMF vs. Pt, µV/°F (µV/°C)	-2.6E-03 (-4.7E-03)
Specific Heat Capacity, Btu/lb-°F (J/g-K)	0.074 (0.310)

Parameter	Value
Elastic Modulus, Msi (GPa)	17.7 (122)
Shear Modulus, Msi (GPa)	6.47 (44.6)
Poisson's Ratio	0.366
Single Phase/Multiphase	Multiphase
Emissivity	0.257
Tin adhesion out of 3	1.7
Contact resistance (Cres), 30 gf, mΩ	4
Cres, oxidized 1,000h@150°C, 30 gf, mΩ	14
Cres, flowers of sulfur 720h@50°C, 30gf, mΩ	19

Temper Dependent Properties

Material Tested: Fine and Intermediate Wire

	Annealed	Cold Worked	HT Temper	HTA Temper	HTB Temper	HTC Temper	HTD and F9 Temper	SC
Proportional Limit, ksi (MPa)	-	193 (1330)	-	-	-	-	-	222 (1530)
0.2% Offset Yield Strength, ksi (MPa)	152 (1050)	210 (1450)	218 (1500)	210 (1450)	202 (1390)	239 (1650)	217 (1500)	228 (1570)
Ultimate Tensile Strength, ksi (MPa)	160 (1100)	231 (1590)	225 (1550)	216 (1490)	207 (1430)	247 (1700)	237 (1600)	234 (1610)
Elongation (% in 2")	17	2	2	2	2	2	2	2
Knoop Microhardness	320	455	425	476	420	455	425	440
Vickers Microhardness	320	465	435	485	445	465	420	415
Bend Formability - Good Way, min. R/T	-	-	-	-	-	<0.67	-	-
Bend Formability - Bad Way, min. R/T	-	-	-	-	-	<0.5	-	-
Electrical Resistivity, µΩ-cm	22	19	13	12	11	11	2	12
Electrical Conductivity, %IACS	8	9	14	14	15	16	12	14
Thermal Conductivity, W/m-K	33	37	54	58	62	66	357	58

Material Tested: Strip

	Annealed	Cold Worked	HT Temper	HTA Temper	HTB Temper	HTC Temper	HTD and F9 Temper	SC
Proportional Limit, ksi (MPa)	-	-	-	-	-	-	-	-
0.2% Offset Yield Strength, ksi (MPa)	-	-	-	-	-	-	-	-
Ultimate Tensile Strength, ksi (MPa)	-	-	-	-	-	-	218 (1500)	-
Elongation (% in 2")	-	-	-	-	-	-	2	-
Knoop Microhardness	-	-	-	-	-	-	425	-
Vickers Microhardness	-	-	-	-	-	-	420	-
Bend Formability - Good Way, min. R/T	-	-	-	-	-	-	-	-
Bend Formability - Bad Way, min. R/T	-	-	-	-	-	-	-	-
Electrical Resistivity, µΩ-cm	-	-	-	-	-	-	-	-
Electrical Conductivity, %IACS	-	-	-	-	-	-	12	-
Thermal Conductivity, W/m-K	-	-	-	-	-	-	-

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