Properties of Paliney® 25

  • Originally developed to advance IC wafer probe testing technology
  • Electrical Conductivity 28% IACS
  • High Tarnish Resistance
  • Excellent Thermal Stability Under Load
  • Wire diameters available from 25 um (0.001 inch) to 500 um (0.020 inch)
    Foils Availibe from 20 um to 100 um
Typical Applications 
  • Test Probes - Cantilever, Cobra, Vertical Probe Pins
  • Contact Pins
  • Foils
Properties of Age Hardened Temper Paliney® 25
Nominal Values
Solidus/Melting Point 1090°C (1995°F)
Liquidus 1165°C (2130°F)
Density 10.6 g/cm³ (111.7 dwt/in.³)
Specific Heat Capacity 0.28 J/g-K (0.067 Btu/lb-°F)
Electrical Resistivity at 20°C (68°F) 6.3 μΩ-cm
Electrical Conductivity at 20°C (68°F), 28%IACS
Temperature Coefficient of Resistance (CTR) 1.32 x 10-3 /K (7.33 x 10-4 /°F)
Thermal Conductivity 116.0 W/m-K (67.0 Btu/hr-ft-°F)
Coefficient of linear Thermal Expansion (CTE) 12.7 x 10-6 /K (7.1 x 10-6 /°F)
Knoop Microhardness HK50400
Yield Strength 965 MPa (140.0 ksi)
Ultimate Tensile Strength 1240 MPa (180.0 ksi)
Total Elongation 10%
Modulus of Elasticity 135.0 GPa (19.6 ksi)
Poisson's Ratio 0.36

The information contained in this Data Sheet is intended to assist you in the use of this product.  It is not intended to and does not create any warranties, express or implied, including any warranty of merchantability or fitness for a particular application.  The user should determine the suitability of this material for each application.  Data is subject to change without notice.



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