Properties of Paliney® 25

  • Originally developed to advance IC wafer probe testing technology
  • Electrical Conductivity 27% IACS
  • High Tarnish Resistance
  • Excellent Thermal Stability Under Load
  • Wire diameters available from 25 um (0.001 inch) to 500 um (0.020 inch)
    Foils Availibe from 20 um to 100 um
Typical Applications 
  • Test Probes - Cantilever, Cobra, Vertical Probe Pins
  • Contact Pins
  • Foils
Properties of Age Hardened Temper Paliney® 25 Nominal Values
Solidus/Melting Point, °C (°F) 1090.0 (1995.0)
Liquidus, °C (°F) 1165.0 (2130.0)
Density, g/cm³ (dwt/in.³) 10.5 (110.7)
Specific Heat Capacity, J/g/K (Btu/lb/°F) 0.28 (0.067)
Electrical Resistivity, μΩ-cm, 20°C (70°F) 6.35
Electrical Conductivity, %IACS 27 (0.067)
Temperature Coefficient of Resistance, 1/K (1/°F) 1.32 x 10-3 (7.33 x 10-4)
Thermal Conductivity, W/m/K (Btu/hr/ft/°F) 116.0 (67.0)
Coefficient of linear Thermal Expansion(CTE), 1/K (1°F) 12.7 x 10-6 (7.1 x 10-6)
Hardness(Knoop, HK50) 400
Yield Strength, MPa (ksi) 1035.0 (150.0)
Ultimate Tensile Strength, MPa (ksi) 1310.0 (190.0)
Total Elongation, % 10
Modulus of Elasticity, GPa (MSI) 135.0 (19.6)
Poisson's Ratio 0.36
Typical Applications test probes - cantilever, cobra, vertical probe pins

The information contained in this Data Sheet is intended to assist you in the use of this product.  It is not intended to and does not create any warranties, express or implied, including any warranty of merchantability or fitness for a particular application.  The user should determine the suitability of this material for each application.  Data is subject to change without notice.

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